Coolpad has announced that it will be launching its next flagship smartphone, the Cool Play 6, on August 20 at an event in Dubai. The company has sent out invitations to the media regarding the same.
The Cool Play 6 will be the next flagship smartphone in the company’s lineup. It will likely feature a Snapdragon 653 chipset, 6GB of RAM and 64GB of expandable storage. Other specs include a dual 13MP, f/2.0, PDAF camera setup, back-mounted fingerprint reader and a 4,000 mAh, or so battery.
Also, from the images shared with us, we can see that the phone also has a dual camera system on the back, which is in vogue these days. The back seems to be made out of aluminum albeit with plastic bits at the top, meaning this is not a unibody metal design. The overall design is very similar to LeEco phones, especially from the front, which is not surprising since LeEco is a major shareholder in the company and some of the existing Coolpad devices are essentially by LeEco.